Solder paste technology : principles and applications /

Bibliographic Details
Main Author: Johnson, Colin C.
Other Authors: Kevra, Joseph.
Format: Book
Language:English
Published: Blue Ridge Summit, PA: TAB Profesional and Reference Books, 1989..
Subjects:
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020 |a 0830632034  
040 |a LOC 
041 0 |a eng 
050 |a TT267 
090 0 0 |a TT267   |b J68 1989 
100 0 |a Johnson, Colin C.  
245 1 0 |a Solder paste technology :   |b principles and applications /   |c Colin C. Johnson and Joseph Kevra.. 
260 |a Blue Ridge Summit, PA:   |b TAB Profesional and Reference Books,   |c 1989.. 
300 |a xvii, 286 p:   |b ill.;   |c 24 cm.. 
500 |a Index: p. 281-286. 
504 |a Includes bibiliographical references. 
650 0 |a Solder pastes.  
700 0 |a Kevra, Joseph.  
998 |a 1596. 
999 |a 0000000391  |b Book  |c Open Shelf  |e Perpustakaan CIAST